Electronics manufacturing in transition

More performance, greater process reliability and new solutions for demanding SMT application

The requirements in SMT manufacturing continue to rise. More powerful processors, larger PCBs and higher quality expectations call for production solutions that combine performance, process reliability and investment protection. With the new SIPLACE V placement platform, the ASMPT DEK TQ printing platform and solutions for modern AI server boards, ASMPT shows how SMT lines can be prepared to meet the challenges of today and tomorrow.

Performance for everyday production

What matters is not the performance figure on a data sheet, but the output achieved in day-to-day production. This is exactly what the new SIPLACE V placement platform was designed for. A more rigid machine frame, optimized axes and a new generation of placement heads enable fast and precise processing, even for complex assemblies. Depending on the application, productivity gains of up to 30 percent are possible under real-life production conditions. Compatibility was another key focus. Existing SIPLACE X feeders can continue to be used, as can proven software and automation solutions. This allows manufacturers to modernize existing lines step by step. At the same time, the platform’s internal Gigabit Ethernet communication with its high bandwidth and low latency provides the technical basis for future extensions and data-intensive applications.

Quality starts with the solder paste printing

Stable SMT production starts with stencil printing. Even small deviations in solder paste volume or alignment can affect all subsequent process steps. This is why ASMPT has continued to develop the DEK TQ printing platform. Alongside high printing precision, the focus is on automation and process stability. High-speed under stencil cleaning, intelligent paste management and, in the future, automated stencil and squeegee
changeovers reduce operator assists and increase machine availability. Together with closed-loop control and open interfaces such as IPC-HERMES-9852 and IPC-CFX, the printing process can be seamlessly
integrated into modern SMT lines, where it is continuously optimized automatically.

New requirements for AI server board production

Modern AI server boards are creating new challenges for SMT manufacturing. Processor BGAs with dimensions of up to 150 × 150 mm, weights of more than 500 grams and connection counts in the high four digits are becoming part of everyday production. Future generations are expected to require BGAs with more than 20,000 balls. At the same time, PCB dimensions are increasing, while thousands of miniaturized components must be placed with high precision. As individual high-performance processors can have a material value of US$10,000 or more, comprehensive inline quality control is essential. SIPLACE placement machines already provide the technologies needed for these applications. Heavy-duty conveyors transport large-format PCBs safely through the placement process. The SIPLACE Smart Pin Support automatically stabilizes the boards and helps prevent deflections and vibrations during the placement process. Integrated inspection functions check critical areas directly inside the placement machine before the processor is placed. The concept is complemented by specially adapted nozzles, optimized motion profiles and optional 3D coplanarity inspection. This makes it possible to process even large, heavy and expensive processor BGAs with a high degree of process reliability. 

Readiness for the future comes from the complete line

As complexity increases, the interaction between all process steps becomes even more important. What counts is the consistent coordination of the entire SMT line – from solder paste printing and placement to integrated quality control. ASMPT platforms are designed with precisely this interaction in mind. They help electronics manufacturers master current production tasks reliably while creating the foundation for future technologies. 

More info on ASMPT’s advanced Stencil Printer and
Pick & Place platforms and intelligent software
can be found at ASMPT SMT Solutions.