Indium Durafuse™ LT, low-temperature solder paste
Partnertec news flash
Durafuse® LT is a new patented low-temperature alloy system designed to provide high reliability in applications requiring a reflow temperature below 210°C. Durafuse® LT offers improved drop shock resilience, outperforming bismuth-tin (BiSn) or bismuth-tin-silver (BiSnAg) alloys, and even surpassing SAC305 with an optimized process setup. Durafuse® LT comprises a low-melting indium-containing alloy and a higher-melting SAC alloy. The SnInAg alloy initiates joint fusion, while the SAC alloy provides enhanced strength and durability. Durafuse® LT is ideal for high-reliability applications with thermally sensitive components or boards and those requiring step soldering.