Solder joints are created during the reflow process. Reliable solderjoints can only be formed if the soldering profile follows the rules set by the solder paste manufacturer. Every component on a board should reach a similar temperature profile and this is challenging when board get more complex, with heavy inner layers and a high mix of large and small componenent. And a reflow oven should be able to match your production output demand. Selection of the right equipment with specific features for your application is very important.


