Solder Paste and Preforms

One of the most important steps in the complete SMT assembly process is the Stencil Printing Process. The selection of a suitable solder paste, perfect stencil geometry design and correct setup of the stencil printer is crusial.

Partnertec offers the complete solution, including equipment, solder paste and in house designed and manufactured laser cut stencils.

We provide on-site process support for your printing process, together with our partners ASMPT  and Indium Corporation.


Indium Corporation is the leading materials supplier to the global electronics, semiconductor, thin film, thermal management and solar markets. They develop, manufacture, and market solders, electronics assembly and packaging materials, pure indium, gallium, germanium, and tin, as well as alloys and inorganic compounds.

Indium Corporation’s scientists, application engineers, and technical support engineers work closely with  customers to develop custom solutions to their technical problems and optimize their processes to:

   • Increase yields
   • Improve customer satisfaction
   • Increase revenues
   • Reduce defects
   • Deliver high value and return on investment

For every conceivable application there is a solution.

Solder Paste and Preforms

Selecting the right solder alloy, sphere dimension and flux type is key to producing high quality end products. Indium Manufacturing Engineers have developed a wide range of solder paste to meet the market demands for smaller parts, alternative materials, optimized packaging, from prototype built to high production volume. 

Indium offers:
   • A thorough understanding of each customer’s needs and applications
   • A seasoned problem-solving aptitude
   • Knowledge of manufacturing processes and materials handling requirements
   • Expertise in metal fabrication, product packaging, and customer satisfaction
   • Proven achievements with: Pb-free materials, halogen-free materials, Heat-Spring®, NanoFoil®, patented alloys, flux           coatings, indium-containing low-temperature materials, and more. 

Our Goal: Increasing your productivity and profitability through premium design, application and service of advanced materials. 



The Printed Circuit Assembler’s Guide to Solder Defects.

Stencil Printing is a delicate process and both solder pasta and process set-up do effect the quality of the solder joint.  Typical issues such as Voiding, Graping, Head in Pillow, Non Wet Opens, Tombstoning, insufficient Solder and Solder Balling should be avoided.
Indum offers a guide to find solutions for each defect.