Solder Paste Inspection

To avoid quality issues and process problems its important to Verify the amount of solder paste on a board prior to proceeding to the Pick & Place process.  Up to 70% of the end-of-line Quality is related to the Printing process. On-board Paste Verification in the Printer or External inspection in an Automated Solder Paste Inspection (SPI) machine can avoid a lot of problems. 


ASMPT,  the nr 1 in Printers and Pick & Place Equipment, but also first in offering a SPI machine with 100% close-loop process controle  for ASMPT DEK Stencil printers. Digital Moire Image projection is used to gain the most accurate measurements in todays industry.

Advanced Process Expert software is used for DFM analyse, Process Optimizing and Control


 MEK is an industry leader in Automated Optical Inspection and Solder Paste Inspection,

MEK’s latest 5D SPI system, Iso Spector S2, uses very fast blue laser technology for 3D measurement in combination with advanced 2D vision algorithms to focus only on what matters; the solderpaste.

ASMPT HawkEye - On board 2D Paste Verification in DEK Printers

HawkEye is a low cost, clever option for your DEK Stencil Printer to verify if sufficient paste is printed on selected locations. The tool is easy to program and compares the size of the aperture in the stencil with the printing result. If defects are detected, the printer can clean the stencil and reprint on the same board to fix the problem.

ASMPT Process Lens (HD) and Process Expert

ASM ProcessLens is a high end 5D Moire SPI System.  Integrated with the advanced ProcessEngine software it offers the first Process Expert system in the world that can optimize your DEK Stencil Printer and close-loop controle almost all parameters of your Printer.  Process Lense is now available in a HD Version too, for even faster and more accurate measurements.

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MEK IsoSpector S2

MEK's IsoSpector S2 uses a patented 5D inspection sensor technology  that allows for simultaneous capture of colour 2D imaging and accurate and repeatable 3D images using a single sensor; high speed capture with switchable resolution on the fly; shadow free measurements using dual combined 3D and 5D image processing; inspecting beyond the Aperture; inspection of volume, area, height offset, bridge, slumping and detection of anomalies in printing. The result is the ability for defect detection beyond that previously possible.

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