Using a well designed and clean Stencil in your Stencil Printing Process is very important. After printing, the remaining Solder Paste must be removed from the stencil to avoid that paste dries out and apertures get blocked. Stencils become more complex due to increasing component sizes and more SMD's per PCB. Smaller and lager amounts of apertures in a stencil require more advanced cleaning techniques. Partnertec offers a wide range of solutions for low- volume manual sollutions and for automated stencil cleaning processes.