Partnertec news flash
TEKNEK, a manufacturer of contact cleaning equipment, has recently published an interesting whitepaper. The prevalence of Foreign Object Debris (FOD) has become a significant concern in the Surface Mount Technology (SMT) and Printed Circuit Board Assembly (PCBA) sector. FOD, encompassing any foreign material that jeopardizes electronic components or assemblies, poses risks of malfunction and damage throughout manufacturing, assembly, and product operation. As the industry grapples with increasingly complex and compact electronic devices, innovative solutions are sought to mitigate FOD-related challenges and ensure reliable production processes.
The whitepaper describes the potential risks of FOD and how contact cleaning can contribute to better yield and reliability. Download the whitepaper here:
