E by Dek Printing Solution
NeoHorizon Printing Solution
E by Dek Printing Solution
E by Dek is the newest member of the E Solutions from ASM. Now we can offer you a total and complete package. E by Dek can be as indiviual as your requirements.
AMS already set new standards in quality, performance and ease of use in the mid-speed placement segment with the E by SIPLACE. Now they joined the ideal printer solution with the E by DEK.
E by DEK is as flexible as your applications and instead of investing in new printer models the E by DEK Always has the right answer thanks to a wide range of options. They have made it exceptionally flexible and will protect your investment.
With line monitoring, integrated software solutions, traceability and fast, trouble free setup processes for high-mix contract manufacturers and the production of small batches and prototype E-Solutions is the all-round line solution for the mid-speed segment.
Machine standard configuration
The most important facts and figures on the E by DEK.
Machine Performance | Specification |
| Alignment | > 2.0 Cmk @ ± 12.5 μm (± 6 sigma) |
| System alignment capability | > 2.0 Cmk @ ± 25 μm (± 6 sigma) |
| Opyimum core cycle time | 8 seconds |
| Substrate size | 50 mm (X) x 40.5 mm (Y) to 620 mm (X) x 508.5 mm (Y) |
| Operating System | Windows 7 Embedded |
| Squeegee pressure mechanism | Software-controlled, motorized with closed loop feedback |
| Stencil positioning | Semi-auto stencil load with drip tray |
| Understencil cleaning | Interchangeable understencil cleaner (IUSC), fully programmable with wet/dry/vacuum wipe |
| Adjustable-width stencil mount (AWSM) | Frame variants - fully adjustable to accommodate frame sizes in the range of 381 mm to 736 mm |
| Substrate thickness | 0.2 mm to 6 mm |
| Substrate weight (maximum) | 6 kg |
| Substrate warpage | Up to 7 mm including substrate thickness |
| Substrate fixture | Over the top clamps Edge clamps Foil-less clamps Vacuum |
| Temperature & humidity sensor | Monitoring of the process environment |
* Alignment qualifications include board loading/unloading, board clamping, camera/table movement. Capability value is calculated with 3rd-party QC-Calc software.
# Machine capability comprises board loading/unloading, board clamping, camera/rising table movement and print process. The capability value is calculated with 3rd-party QC-Calc software.
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